消息称 AMD CEO 苏姿丰将拜访台积电 商谈 2nm 和 3nm 芯片产能
9 月 25 日消息，据台媒报道，AMD 首席执行官苏姿丰和公司其他 C 级高管计划于 9 月底至 11 月初前往台湾地区，打算会见台积电、芯片封装专家和大型 PC 制造商。苏姿丰计划与台积电首席执行官魏哲家讨论未来的合作。台媒援引知情人士的消息称，讨论的主题包括台积电的 “N3 Plus” 制造节点（可能是 N3P）和 N2（2nm 级）制造技术的使用。
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